JPH0442946Y2 - - Google Patents
Info
- Publication number
- JPH0442946Y2 JPH0442946Y2 JP1983064655U JP6465583U JPH0442946Y2 JP H0442946 Y2 JPH0442946 Y2 JP H0442946Y2 JP 1983064655 U JP1983064655 U JP 1983064655U JP 6465583 U JP6465583 U JP 6465583U JP H0442946 Y2 JPH0442946 Y2 JP H0442946Y2
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- lead
- lead wire
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983064655U JPS59171360U (ja) | 1983-04-28 | 1983-04-28 | 自動插入用発光ダイオ−ドランプ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983064655U JPS59171360U (ja) | 1983-04-28 | 1983-04-28 | 自動插入用発光ダイオ−ドランプ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59171360U JPS59171360U (ja) | 1984-11-16 |
JPH0442946Y2 true JPH0442946Y2 (en]) | 1992-10-12 |
Family
ID=30194840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983064655U Granted JPS59171360U (ja) | 1983-04-28 | 1983-04-28 | 自動插入用発光ダイオ−ドランプ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59171360U (en]) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5163952U (en]) * | 1974-11-14 | 1976-05-20 | ||
JPS56137466U (en]) * | 1980-03-18 | 1981-10-17 |
-
1983
- 1983-04-28 JP JP1983064655U patent/JPS59171360U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59171360U (ja) | 1984-11-16 |
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